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TO8 Header Encapsulated Components Transistor Outline Package

JOPTEC LASER CO., LTD
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TO8 Header Encapsulated Components Transistor Outline Package

Brand Name : JOPTEC

Place of Origin : HEFEI, CHINA

MOQ : 50 PCS

Payment Terms : T/T

Supply Ability : 5000000 PCS/Month

Delivery Time : 30 Days

Packaging Details : Boxes

Welding ring : HLAgCu28

Cap : 10#Steel

Lead : 4J29(Kovar)

Glass insulator : BH-G/K

Bottom floor : 4J29(Kovar)

Hermeticity : ≤1*10-3Pa.cm3/s

Shell : FeNiCo,FeNi42 or CRS

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Product name: Sealed enclosure alloy package for circuit
Finish: Fully plating Au or selective plating Au.
Plating coating: Plate and lead plating Ni:4-11.43um,plating Au:1.0-1.3um. Cap plating Ni:4-11.43um.
Product formation: Material Quantity
1. Cap 10#Steel 1
2. Welding ring HLAgCu28 1
3. Lead 1 4J29(Kovar) 1
4. Glass insulator BH-G/K 3
5. Lead 2 4J29(Kovar) 3
6. Bottom floor 4J29(Kovar) 1
Insulation resistance 500V DC resistance between single glass sealed pin and shell is ≥1*1010Ω
Hermeticity Leak rate is ≤1*10-3Pa.cm3/s
Product features: 1. Shell adopt material:FeNiCo,FeNi42 or CRS;
2. The shape of pin is cyclinder and straight,material adopts Kovar.
3. The sealing cap method is percussion welding or tin welding.

4. The rank of pin which cross the bottom of base could be choosen

by customers.

5. The position of ground pin can be choosen by customer.
6. The design of caps need to fit the shell.
7. Customer could choose shell fully plating or pin selective plating.

Product Tags:

TO8 Encapsulated Transistor Outline Package

      

TO8 Enclosure Transistor Outline header

      

TO8 Transistor Outline Metal Package

      
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TO8 Header Encapsulated Components Transistor Outline Package Images

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